High Purity Barium Sulfate From Yunfu Hongzhi New Materials Co., Ltd. Is Used As A High-purity Filler in Batteries And Copper-clad Laminate Substrates

High Purity Barium Sulfate can be used as a cathode expansion agent in lead-acid batteries. Barium sulfate and lead sulfate have similar crystal structures and are isomorphous substances. Adding High Purity Barium Sulfate, due to its high purity and acid and alkali resistance, can serve as the crystal center of lead sulfate, guide the formation of regular active crystals, and play a delayed passivation effect. For example, in frequent charging and discharging scenarios such as electric vehicles and energy storage systems, adding High Purity Barium Sulfate can reduce the internal resistance of the battery, improve the charging and discharging efficiency, and delay the cycle life of the battery.

High Purity Barium Sulfate is used in high-power lithium battery separators to improve the uniformity of membrane pores and the mechanical properties and thermal stability of the film. For example, in high-power lithium electric tools, adding High Purity Barium Sulfate can ensure uniform transmission of lithium ions and improve the stability of rapid charging and discharging. In addition, High Purity Barium Sulfate has good inertness, can resist electrolyte erosion, and reduce the generation of harmful gases or substances by reactions with electrolytes.

In multi-layer copper clad laminate substrates, High Purity Barium Sulfate has good dispersibility and can be evenly filled between the copper foil and the substrate to form an insulating layer, reducing the risk of mutual interference and leakage between circuits. High Purity Barium Sulfate has a high melting point, good thermal stability, and a low thermal expansion coefficient. It can reduce the dimensional change rate of the board under different temperatures and humidities, improve the heat resistance of the board, and reduce the risk of board explosion and circuit failure. In addition, High Purity Barium Sulfate has a uniform particle size and low oil absorption. Adding it can enhance the mechanical strength and interlayer bonding, so that the overall strength and solder resistance of the copper clad laminate can be enhanced during use.

Adding High Purity Barium Sulfate can also improve the overall flame retardancy and high voltage electrical breakdown resistance (CTI) performance of multi-layer copper clad laminate substrates.